Manufacturing Capabilities // METAL FABRICATION

Photochemical Machining

Photochemical Machining is just one area where we continue to advance technology in the medical device industry.

 

The right photochemical machining solutions for medical challenges rely on long-standing, unique methods. Our solutions have been implemented and innovated for years.

Resonetics has been producing unprecedented photochemically machined components for over 50 years. Resonetics is widely recognized as a leader in precision etching of thin materials.

These photochemical etching techniques use a strategic combination of exclusively designed equipment. Therefore, Resonetics’ in-house methods allow your medical devices to benefit from their custom resist, online process control, and enhanced metrology capabilities. With these capabilities, we can produce high volume products with leading-edge tolerances and unprecedented results in both through-etch and partial-etch processes.

 

PHOTOCHEMICAL MACHINING FEATURES

  • High resolution complex components
  • Through-etch for discrete components
  • Partial-etch for blade sharpening
  • Tight tolerance (+/- 10 microns)


APPLICATIONS

  • Blades
  • Microfluidic sensors
  • Filter screens

THROUGH-ETCH
FEATURE TOLERANCES

  • Through feature minimum size is equal to the material thickness plus 0.025 mm
  • Standard through feature tolerance is ± 15% of metal thickness
  • Critical through feature tolerance is ± 10% of metal thickness (±0.010 mm min)
  • Standard center-to-center tolerance is ± 0.010 mm

PARTIAL-ETCH
FEATURE TOLERANCES

  • Partial-etch thickness reduction capability is available for single or multiple areas and depths
  • Standard partial-etch features are 65% reduction in material thickness (0.025 mm min)
  • Standard partial-etch depth tolerance is ± 10% of metal thickness removed (± 0.004 mm min)

SUBSTRATE
SIZE/THICKNESS

  • Thickness range: 0.015 mm - 0.500 mm
    Standard sheet size: 12"x27" (305 mm x 686 mm)
  • Capable of etching sheets up to 20"x27" (508 mm x 686 mm)

CAPABILITIES

  • High-volume manufacturing
  • On-site automation and tooling team iterate and scale quickly
  • Glass photo tools for precision high volume capability
  • Experts at advanced etching techniques such as surface texturing and partial depth etching
  • High yield, high volume 0.6 mil (15 micrometer) line / space circuit etching with 12 micrometer Cu thickness
  • Automated vision inspection systems to ensure product quality
 

PHOTOCHEMICAL ETCHING NEWS