Manufacturing Capabilities // METAL FABRICATION

Photochemical Machining

We continue to advance technology in the medical device industry and photochemical machining is one area.

 

Sometimes the right solutions for medical challenges rely on long-standing, unique methods that have been implemented and innovated for years.

Resonetics has been producing unprecedented photochemically machined components for over 50 years and is widely recognized as a leader in precision etching of thin materials.

These photochemical etching techniques use a strategic combination of exclusively designed equipment. Resonetics’ in-house methods allow your medical devices to benefit from their custom resist, online process control, and enhanced metrology capabilities to produce high volume products with leading-edge tolerances and unprecedented results in both through-etch and partial-etch processes.

 

PHOTOCHEMICAL MACHINING FEATURES

  • High resolution complex components
  • Through-etch for discrete components
  • Partial-etch for blade sharpening
  • Tight tolerance (+/- 10 microns)

 

APPLICATIONS

  • Blades
  • Microfluidic sensors
  • Filter screens

THROUGH-ETCH
FEATURE TOLERANCES

  • Through feature minimum size is equal to the material thickness plus 0.025 mm
  • Standard through feature tolerance is ± 15% of metal thickness
  • Critical through feature tolerance is ± 10% of metal thickness (±0.010 mm min)
  • Standard center-to-center tolerance is ± 0.010 mm

PARTIAL-ETCH
FEATURE TOLERANCES

  • Partial-etch thickness reduction capability is available for single or multiple areas and depths
  • Standard partial-etch features are 65% reduction in material thickness (0.025 mm min)
  • Standard partial-etch depth tolerance is ± 10% of metal thickness removed (± 0.004 mm min)

SUBSTRATE
SIZE/THICKNESS

  • Thickness range: 0.015 mm – 0.500 mm
    Standard sheet size: 12″x27″ (305 mm x 686 mm)
  • Capable of etching sheets up to 20″x27″ (508 mm x 686 mm)

CAPABILITIES

  • High-volume manufacturing
  • On-site automation and tooling team iterate and scale quickly
  • Glass photo tools for precision high volume capability
  • Experts at advanced etching techniques such as surface texturing and partial depth etching
  • High yield, high volume 0.6 mil (15 micrometer) line / space circuit etching with 12 micrometer Cu thickness
  • Automated vision inspection systems to ensure product quality
 

PHOTOCHEMICAL ETCHING NEWS