MANUFACTURING CAPABILITIES // METAL FABRICATION
Resonetics uses plating to facilitate manufacturing micro sensors.
Plating is the process of building up a layer of metal onto a substrate. This process is used to enable our unique sensor fabrication capabilities.
- Typical thickness: 0.1 μm to 20 μm
- Typical tolerance: ±10% to ±50% of target
- Product size: 1 mm to 600 mm
- Plated vias down to 0.1 mm (Outside diameter of copper pad, Inside of 0.025 mm via diameter)
PROCESS CONTROL AND PRODUCT QUALITY METHODS
- Real-time monitoring and control of plating bath chemistries and process conditions for superior product quality
- Thickness control measured through X-ray fluorescence: XRF/VXR
- Plated film integrity: Heat and humidity stress test, porosity, bending, and stress-strain test
- Plating thickness uniformity: Thickness uniformity optimization using COMSOL FEA modeling
Resonetics coats and patterns a variety of polymer materials.
The benefit of coating with Resonetics is the ability to meet the unique surface preparation process of each device before coating; an important and varying need to consider. Multiple processing methods are available, depending on thickness, material properties and feature sizes required.
Polymer coating enables integrated sensor and circuit components, all in one assembly, eliminating additional manufacturing steps.
DEFINITION & OVERVIEW
- Wet chemistry etching for polyimide
- Direct patterning using photoimagable materials
DIMENSIONS & TOLERANCE
- Margin capability 0.025 mm
- Minimum hole size 0.035 mm (on 0.010 mm thick polyamide)
COATING PROCESSES AND METHODS
- Enables best capability based on substrate / material being coated
- Slot die coating
- Roller coating
- Spray coating
- Dip coating
- Multiple in-line and stand-alone cure ovens
- Strain gauge sensor
- Near Field Communication (NFC) Wireless Connector
- RTD (Resistance Temperature Detector) Sensor