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Polymer Laser Processing

Polymer laser processing is a cutting-edge manufacturing process. This technique involves the removal of material from a solid surface by irradiating it with a laser beam. The high-intensity laser beam quickly breaks polymer molecular bonding by directly heating the polymer to a temperature that causes it to vaporize locally without affecting the integrity of the surrounding material. This method is highly precise, allowing for intricate cuts and patterns that are not possible with traditional mechanical processing methods.

Advantages of Polymer Laser Ablation

  • Precision and Accuracy: Laser ablation allows for extremely precise cuts with clean edges, reducing the need for post-processing.
  • Versatility: This technique can be used on a variety of polymers, including sensitive and flexible materials.
  • Non-contact Process: Since the laser does not physically touch the material, there is no mechanical wear and tear, resulting in better product longevity.
  • Customization: Laser parameters can be easily adjusted to meet specific requirements, allowing for high customization of the ablation process.

Our Technology

At Resonetics, we use state-of-the-art laser systems equipped with excimer lasers and ultra-short pulse lasers that provide exceptional control over beam intensity, duration, and heat output. This ensures the highest quality of work with minimal thermal damage to the materials.

    Our specialties include but not limited to:

  • Ablation depth control for blank (not through) vias or other features
  • Selective material removal (remove top layers of material without damage underneath materials)
  • 3D feature processing
  • Multilumen processing with dynamic OD control
  • Reel-to-reel wire coating stripping
  • Profile control micro-via array drilling

Applications

Polymer laser ablation is utilized in a variety of applications such as:

  • Creating microfluidic devices
  • Catheters
  • Other components with high precision
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Microfluidics: Laminate Tolerancing, Capability and Measurements in Laser Processing

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